Micron Technology successfully demonstrated the world's first 512GB DDR5 RDIMM module, enabling data centers to support large AI and analytics workloads with speeds up to 9,200 MT/s and 60% reduced power consumption. The innovation uses advanced vertical interconnect packaging with through-silicon vias to achieve high density while maintaining performance, with validation from AMD and Intel underway.
JPMorgan forecasts HBM semiconductor shortages persisting through 2028, with demand growing from 1.2B to 10.8B GB-equivalent annually while CoWoS packaging remains the binding constraint. AI infrastructure spending is heavily concentrated among top companies, with GPU compute representing 80% of AI application costs and driving pricing power for suppliers like Micron and SK Hynix.