# HBM demand — X 热门讨论 (2026-09-21 10:48 UTC)
## @SemiconductorsX (Semiconductor Insider) · 09-21 03:41 · ♥32 ↻2 💬9 Samsung Electronics and SK Hynix will significantly increase High Bandwidth Memory (HBM) production next year. Still expect 2027 to run short.
The Fact says both firms have pulled expansion forward because a new line takes two to three years from dirt to wafers. Customers are already shopping for 2027 bits.
Samsung is said to aim for twice this year’s HBM4 and HBM4E output next year. Wafer starts would rise from about 180,000 a month to 250,000.
HBM4-class mix would go from 40% of HBM shipments to 80%. Glass-carrier clean work jumping from 20,000 wafers a month to 50,000 is read as another tell. About half of its 4nm foundry, some 15,000 wafers a month, is said to be reserved for HBM4 base dies.
Pyeongtaek P5 may drop floors to finish sooner. Counterpoint put its second-quarter HBM sales share at 33%, up 12 points from the prior quarter. $SKHY SK Hynix is lifting Cheongju M15X from about 10,000 wafer starts a month toward 80,000. The first Yongin fab is being pulled toward a 2027 start. 2027 volume and price talks with big buyers are still open. Last year’s deals slipped to October.
Samsung said in Q1 that supply versus demand was the worst on record and the gap would widen in 2027.
Kiwoom sees 2027 HBM supply up 50% and demand up 56%, with HBM4 prices up about 65%.
Jensen Huang $NVDA said last week he wants to sell twice as many chips next year. Rubin Ultra is slated for 16 HBM4E stacks per package.
Micron $MU has said 2027 HBM is sold out. CXMT is reported to be sampling HBM3E for 2027 volume. https://x.com/SemiconductorsX/status/2101879564171686344