# semiconductor guidance — X 热门讨论 (2026-10-10 14:35 UTC)

## @eWhispers (Earnings Whispers) · 10-10 13:17 · ♥39 ↻8 💬3 Big Banks Take Center Stage as Earnings Season Kicks Into High Gear https://x.com/eWhispers/status/2108909851719983471

## @Gaetano2026 (Gaetano) · 10-10 06:16 · ♥30 ↻6 💬4 $VECO sells the specialized equipment used to manufacture semiconductors and InP lasers.

When chipmakers and optical suppliers expand their factories, Veeco can win business across multiple production steps.

AI demand is translating into sizable orders

$250M+ in InP laser-manufacturing equipment

A separate $200M in advanced packaging

Q2 revenue reached $193.5M, up 16% YoY and 22% QoQ.

Full-year guidance of $780–810M implies roughly 20% growth at the midpoint.

And those laser orders extend the opportunity into 2027.

Management expects shipments to accelerate significantly next year and is expanding manufacturing ahead of the anticipated revenue.

More optical capacity requires more manufacturing equipment.

NFA > 引用 @Gaetano2026: $VECO New Highs Today!

Veeco makes the specialized machines that grow and coat the tiny semiconductor layers used inside AI data centers for both high-speed optical connections and efficient power delivery.

Some highlights:

• Lumina MOCVD systems grow the indium phosphide (InP) crystal layers used for optical connections.

Veeco recently received an order for multiple Lumina tools specifically for data center optical communication solutions

• Propel 300 mm GaN-on-Si systems build power devices that convert electricity more efficiently.

Veeco recently received a multi-chamber order from a leading power IDM for a pilot line tool, likely for AI data centers, with pilot production expected in 2026 and a ramp to high-volume manufacturing in 2027

• IBD EUV and IBD 300 systems. Veeco is the market leader for IBD EUV systems used for the deposition of defect-free films and mask blanks.

Their next-generation IBD 300 system is being evaluated by two DRAM customers to achieve superior thin film properties with lower resistance, which improves device scaling and power consumption

Management notes:

• CEO Bill Miller on GaN adoption: “The efficiency of power conversion in the data center is a real limiting issue… Any material that can be adopted to convert electricity more efficiently is pretty desirous”

• Advanced packaging business doubled this year, with wet processing system orders increasing quarter-over-quarter

Numbers:

• Q3 2025 revenue $166M (beat guidance midpoint of $160M) and non-GAAP EPS $0.36 (beat $0.28 midpoint)

Massive market expansion by 2029: Advanced Packaging SAM → $650M Annealing SAM → $1.3B Ion Beam Deposition SAM → $500M (all driven by AI and high-performance computing)

2026 trajectory: Continued momentum in semiconductor and compound semiconductor markets, with revenue growth expected in both

Full post on the SS tomorrow! https://x.com/Gaetano2026/status/2108803716081987651