HBM demand · X 热门 · 2026-09-18 23:12 UTC

# HBM demand — X 热门讨论 (2026-09-18 23:12 UTC)

## @damnang2 (Damnang) · 09-18 21:55 · ♥37 ↻1 💬1 Interesting points from the SK hynix Forum:

1. Conventional DRAM margins have recently improved faster than HBM margins, creating some short term pressure on SK hynix, which has been heavily focused on HBM. However, the company plans to stay focused on HBM and other next generation memory technologies rather than short term profitability, with the goal of developing new memory solutions for future AI systems.

2. Since the beginning of this year, customer requests for 3D stacked DRAM have increased significantly. This appears to be moving beyond research interest into real customer demand, strengthening the view that memory is heading toward more 3D stacked architectures.

3. HBM thermal management is approaching the limits of what can be solved at the package level alone. Going forward, optimization across HBM, GPUs, interposers, substrates, power delivery, and cooling will become increasingly important at the SiP and system level. Technologies such as advanced packaging, liquid cooling, backside power delivery, and glass substrates could all play a larger role. https://x.com/damnang2/status/2101067521541689580