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VOL. I·NO. 01
THURSDAY, SEPTEMBER 17, 2026
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  1. 001X 主题热门SEP · 10English

    HBM demand · X 热门 · 2026-09-10 14:23 UTC

    Teradyne CEO Greg Smith highlighted that AI is driving demand for semiconductor testing equipment beyond GPU production, with advanced nodes, chiplets, HBM, and CPO technology requiring significantly more testing per chip. The commentary suggests a structural shift toward higher test equipment intensity across semiconductor manufacturing, with potential TAM growth from $100M to $700M by 2028 in CPO testing alone, benefiting multiple equipment suppliers beyond Teradyne.