A supplier provides multilayer and single-layer mirrors for EUV and soft X-ray light (10 eV to 1 keV) used in lithography, research, astrophysics, and plasma observation. They offer design examples with various material combinations like Ru/B4C, Mo/Si, and Au mirrors for different energy ranges.
ASML and Carl Zeiss say their next-generation chipmaking tool, called Hyper NA, could be ready in about 10 years and would print features as small as 5 nanometers using largely existing technology. Major chipmakers including Intel, Samsung, SK Hynix, and TSMC plan to adopt ASML's current High NA technology between now and 2030.