SK Hynix, Samsung, and Micron are ramping HBM wafer production toward year-end 2026 targets of 200,000, 250,000, and 100,000 units respectively. Samsung's aggressive capacity expansion could shift market share leadership in 2027, though SK Hynix's current yield advantage and NVIDIA relationship remain competitive factors. Separately, optical interconnect demand is projected to reach $92B by 2028 with 65% annual growth, positioning silicon photonics and lasers as emerging bottlenecks.