AI capex · X 热门 · 2026-09-23 09:00 UTC

# AI capex — X 热门讨论 (2026-09-23 09:00 UTC)

## @The_AI_Investor (The AI Investor) · 09-23 04:10 · ♥32 ↻2 💬4 Glass substrates are arriving sooner than planned.

NVIDIA is pressing its substrate makers to speed up development, which could bring adoption to before 2028. BOE has 24 layer substrates over 100 by 100 mm already validated in house and being tested with real server CPUs and GPUs, with a mass production investment decision by 1H27. Samsung Electro Mechanics and LG Innotek are targeting 2027 to 2028.

Glass replaces the conventional core inside the package with a much flatter and more stable material, so AI chips can be packed denser and run cooler. Packaging is turning into the next capex fight after CoWoS.

-TrendForce https://x.com/The_AI_Investor/status/2102611528331706530