Nvidia is exploring glass substrates for its AI chips to enable higher stacking of HBM memory, offering 40% faster speeds and half the power consumption compared to plastic alternatives. Equipment maker SCHMID is developing glass core substrate technology with Intel, Nvidia, and AMD supply chains, though metallization challenges remain and no customer has yet qualified the process. CEO Huang has engaged SK Group and pressed TSMC to advance the technology.
NVIDIA is accelerating glass substrate development with suppliers like BOE, Samsung Electro Mechanics, and LG Innotek, potentially bringing adoption before 2028. Glass substrates offer improved thermal performance and density for AI chips, representing the next major capital expenditure battleground after advanced packaging competition.